快瞄
An extensive via drilling portfolio that includes the market-leading flex PCB processing systems and CO2-laser solutions for accurate and affordable HDI PCB manufacturing and substrate processing.
快瞄
Wafer processing solutions that apply optimized laser technology for high-volume production without sacrificing yield.
快瞄
Market-leading solutions for high-volume MLCC testing and production wafer trimming. All drawing on our legacy of leadership in component manufacture and test systems.
快瞄
Metrology systems to accurately detect, measure and monitor quality defects in a range of medical devices, delivering the highest level of quality and accuracy while enabling higher production throughput and reliability.
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For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.
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